Microcapsules used in image-forming substrate and process of pro

Details Microcapsules used in image-forming substrate and process of pro Microcapsules used in image-forming substrate and process of pro

Filed on

1998-10-23

Date issued

2000-10-31

Examiner

Nutter, Nathan M.

Patent Class

Coating processes

SubClass

Particles, flakes, or granules coated or encapsulated

SubSubClass

Solid encapsulation process utilizing an emulsion or...

Other Related Categories

42721334, 42721336, 264 41, 264 433, 264 44, 264 47, B01J 1302, B01J 1304, B01J 1320, B01J 1322

Type

Patent

Status

active

Patent number

061399140

Description

ABSTRACT:
A microcapsule includes a shape memory resin shell wall formed with fissures that do not completely pass through the shell wall, and a dye encapsulated in the shell wall. The shell wall exhibits a temperature/pressure characteristic such that the fissures open, when the shell wall is squashed and compacted under a predetermined pressure at a predetermined temperature, whereby a seepage of the dye frog the squashed and compacted shell wall through the opened fissures is adjustable.

REFERENCES:
patent: 4399209 (1983-08-01), Sanders et al.
patent: 4440846 (1984-04-01), Sanders et al.
patent: 4644376 (1987-02-01), Usami et al.
patent: 5645920 (1997-07-01), Nishiyama

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