Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1999-05-21
2000-10-31
Sells, James
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156252, 156261, 156290, 156292, 1563082, B32B 3100
Patent
active
061396648
DESCRIPTION:
BRIEF SUMMARY
The invention relates to a method of producing plastic cards in accordance with the preamble of patent claim 1.
A method of this kind is known from DE 195 09 233 A1. According to this method, first of all a first web is provided with electronic components in the form of a chip with a prefabricated flat coil which can be connected to it and has a plurality of windings. It is sensible to apply the electronic components, with which this first web is fitted, in advance, so as to form a so-called carrier web. The components are preferably attached by means of an adhesive. The carrier web which has been prefabricated in this way is then supplied to a method of producing chip cards in which this carrier web is incorporated into a layer structure comprising a plurality of webs. To do this, a second web which has apertures for accommodating the electronic components is applied to the carrier web. Then, in a further method step, filler material is introduced into the apertures and smoothed down. A covering web which is provided on at least one side completes the layer structure which is ultimately to be laminated. The effort involved in prefabricating the webs is high. Furthermore, this prefabrication does not allow any different arrangement of the electronic components in a chip card.
WO 96/10803 has disclosed a carrier arrangement which is to be installed in a contactless chip card, in which an endless carrier film is provided with a layer of adhesive to which a multiplicity of transponder units containing a chip and a coil are applied. This arrangement is hermetically packaged by means of a covering film, cutouts in the covering film advantageously being provided in the region of the semiconductor chips. The carrier arrangement comprising transponder units packaged between two films is advantageously wound onto a roll in order to be transported further. In this case too, the need to incorporate a prefitted carrier web is a disadvantage.
To create space in a card body for accommodating the coil and the chip, it is also impossible to hot-press a recess in the case of material which is in the plastic state when warm, such as polyvinyl chloride, since the surface would swell locally and a printed image which may be present on webs laminated on would become distorted.
Therefore, the object of the invention is to provide a method of producing plastic cards according to the preamble of patent claim 1 which operates with a high throughput, a low outlay on machinery and a low reject rate.
The solution according to the invention to this object is defined by patent claim 1. The other claims relate to advantageous refinements of the concept of the invention.
The result is a method which avoids having to incorporate prefitted carrier webs. Rather, the fitting of the components is integrated in the production process of the chip cards. Matching and alignment problems caused by prefabricated carrier webs are eliminated. It is also possible to separate out defective electronic components without also having to get rid of sections of web.
Spots of adhesive or weld spots may be used as the fixing points. Since the number of fixing points can be selected to be low, according to the method of the invention, the spots of adhesive or weld spots do not interfere with the subsequent lamination operation.
If spots of adhesive are used as the fixing points, it is possible, by selecting a suitable adhesive, for the adhesive effect at a spot of adhesive to be exerted repeatedly. This allows first spots of adhesive to take on a dual role, namely to temporarily fix a stamped-out part of the web and, after this part of the web has been removed, to secure a flat coil which is inserted into the area where the piece of web has been removed. So-called autoadhesive agents are preferred.
Further features and advantages of the invention will emerge from the following description of an exemplary embodiment, in which reference is made to the appended drawings, in which:
FIG. 1 shows a plan view of part of a first web, before adhesive is applied, in acc
REFERENCES:
patent: 4863546 (1989-09-01), Melzer et al.
patent: 5779125 (1998-07-01), Melzer et al.
patent: 6019268 (2000-02-01), Melzer et al.
Melzer Rainer
Melzer Roland
Melzer Maschinenbau GmbH
Sells James
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