Metal fusion bonding – Process – Using high frequency vibratory energy
Patent
1998-11-25
2000-10-31
Heinrich, Samuel M.
Metal fusion bonding
Process
Using high frequency vibratory energy
22818022, 228208, H05K 334, B23K 106
Patent
active
061388947
ABSTRACT:
A technique is utilized for coupling a circuit component to a substrate. The circuit component, such as a die, includes a plurality of contacts on one of its surfaces. The contacts may take the form of gold bumps. Solder is placed between the contacts of the circuit component and the contact pads of a substrate. The substrate is heated to about the melting point of the solder, and pressure and ultrasonic energy are used to cause the solder to couple the contacts of the circuit component to the contact pads of the substrate.
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Welding Research Supplement, J. N. Antonevich, "Fundamentals of Ultrasonic Soldering", pp200-s through 207-s, Jul., 1976.
Heinrich Samuel M.
Intermedics Inc.
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