System for real-time control of semiconductor wafer polishing

Details System for real-time control of semiconductor wafer polishing System for real-time control of semiconductor wafer polishing

1997-08-07

1998-12-22

Eley, Timothy V.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 6, 451 7, 451 8, 451 9, 451288, 451289, B24B 4902, B24B 4912, B24B 4914

Patent

active

058511350

ABSTRACT:
A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and a controller selectively adjusting one of a plurality of adjustable polishing parameters during polishing of the wafer.

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Specification of The NoveScan 210: Thickness Monitoring System.

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