Method of forming through-holes in printed wiring board

Details Method of forming through-holes in printed wiring board Method of forming through-holes in printed wiring board

1991-08-02

1993-03-09

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174263, 228 33, 427 97, H01K 310

Patent

active

051917092

ABSTRACT:
In the method for forming through-holes of the present invention, by injecting a conductive material into the through-holes by means of a filling nozzle while removing the excessive conductive material with a squeegee, the filling can quickly and uniformly be performed independently of the board thickness of the substrate and the number and diameter of the through-holes.

REFERENCES:
patent: 4478882 (1984-10-01), Roberto
patent: 4622239 (1986-11-01), Schoenthaler et al.
patent: 4646057 (1987-02-01), Renolds
patent: 4720402 (1968-01-01), Wojcik
patent: 4732780 (1988-03-01), Mitoff et al.
patent: 4808435 (1989-02-01), Cropp et al.
IBM Tech Disclosure Bulletin vol. 14, No. 9, Feb. 1972, pp. 2691-2692 by J. A. Lau et al.

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