Common housing for two semi-conductor bodies

Details Common housing for two semi-conductor bodies Common housing for two semi-conductor bodies

1985-08-05

1987-07-28

Davie, James W.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

165 802, 165 803, 174 16HS, 174 17R, 361381, 361383, 357 74, 357 75, H01L 2302, F28F 700, H01B 734, H02B 100

Patent

active

046834893

ABSTRACT:
A common housing for two semi-conductor bodies is provided, comprising a front and back section for two spatially separate semi-conductor bodies attached in the housing interior but preferably connected in electrically conductive fashion to one another, whereby the housing surface preferably composed entirely of metal is cooled during operation by a flowable coolant, preferably cooling air. The front, first semi-conductor body is attached in the front section thereof and the back, second semi-conductor body is attached in the back section thereof, the maximum operating temperature of the back semi-conductor body being higher than the maximum operating temperature of the front semi-conductor body, at least at times. The thermal resistance between the front semi-conductor body and a front thermally conductive cooling surface as well as the thermal resistance between the back semi-conductor body and a back thermally conductive cooling surface differing from the front cooling surface, being respectively lower than both the thermal resistance in the housing interior between the two semi-conductor bodies as well as the thermal resistance between the front and the back cooling surface. During operation, the coolant first flows past the front cooling surface and subsequently flows past the back cooling surface.

REFERENCES:
patent: 3706010 (1972-12-01), Laermer et al.
patent: 3993123 (1976-11-01), Chu et al.
patent: 4351051 (1982-09-01), van Alem et al.
patent: 4394679 (1983-07-01), Hawrylo
Hassan et al., "High Performance Chip-Cooling Technique", IBM Technical Disclosure Bulletin, vol. 26, No. 7A, Dec. 1983, pp. 3235-3237.
Metreaud, "Air Cooled Semiconductor Chip Module Configuration", IBM Technical Disclosure Bulletin, vol. 20, No. 7, Dec. 1977, pp. 2697-2698.
Kunkler et al., "Module with Removable Heat Transfer Members", IBM Technical Disclosure Bulletin, vol. 23, No. 9, Feb. 1981, pp. 4095-4096.
Shott, "Boat Thermal Enhancement for Semiconductor Chips and Modules", IBM Technical Bulletin, vol. 26, No. 7, Dec. 1977, pp. 2635-2636.
Archey et al., "IBM Technical Disclosure Bulletin, vol. 22, No. 12 (May 1980), pp. 5288-5290.

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