Method for backside damage of silicon wafers

Details Method for backside damage of silicon wafers Method for backside damage of silicon wafers

1989-07-12

1991-04-09

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 9, 437939, 148DIG24, 148DIG60, H01L 21306

Patent

active

050064754

ABSTRACT:
A method of backside damaging a silicon semiconductor wafer by abrading the wafer in an abrasive powder is disclosed. The wafer is rotated or translated in the powder while the powder is being vibrated. A fixture holds one or more semiconductor wafers during the processing and allows the wafer to be rotated during processing if desired.

REFERENCES:
patent: 3923567 (1975-12-01), Lawrence
patent: 4936875 (1990-06-01), Iltis et al.
"Mechanical Preparation of Sapphire Single-Crystal Surfaces by Vibratory Techniques"; Ehman et al.; Metallography, vol. 9, No. 4, pp. 333-339; Aug. 1976.

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