Metalization systems for heater/sensor elements

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428615, 428660, 428661, 428664, 428669, 338308, H01C 702

Patent

active

050064215

ABSTRACT:
Device comprising a substrate and a metallized sensor/heater element having a temperature coefficient of resistance of at least 2000 parts per million. Methods of fabricating the devices are also disclosed.

REFERENCES:
patent: H546 (1988-11-01), Schnable et al.
patent: 3540920 (1970-11-01), Wakefield
patent: 3664874 (1972-05-01), Epstein
patent: 4127840 (1978-11-01), House
patent: 4194174 (1980-03-01), DeLise
patent: 4391846 (1983-07-01), Raymond
patent: 4569742 (1986-02-01), Schuetz
patent: 4580439 (1986-04-01), Manaka
patent: 4682143 (1987-07-01), Chu et al.
patent: 4701769 (1987-10-01), Nishiguchi et al.
patent: 4746896 (1988-05-01), McQuaid et al.
patent: 4760369 (1988-07-01), Tiku
patent: 4803457 (1989-02-01), Chapel et al.
patent: 4804438 (1989-02-01), Rhodes
Lee et al, "Silicon Micromachining Technology . . . " SAE Technical Papers, pp. 1-10.
Allan, Roger, "Sensors in Silicon", High Technology/Sep. 1984, pp. 43-77.
Collins et al, "Tantalum and Cobalt Silicides: Temperature Sensor Applications", Applied Physics A. Solids & Surfaces, vol. A40, No. 2, Jun. 1986, pp. 109-117.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Metalization systems for heater/sensor elements does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metalization systems for heater/sensor elements, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metalization systems for heater/sensor elements will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2033835

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.