Interconnection mechanisms for electronic components

Details Interconnection mechanisms for electronic components Interconnection mechanisms for electronic components

1988-03-18

1989-12-05

Kucia, R. R.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 163, 174 524, 361189, 361408, H05K 118

Patent

active

048851264

ABSTRACT:
An electronic circuit component housing assembly adapted to be mounted mechanically on a printed circuit, using a single mechanical fastener to attach the circuit component housing assembly in a unique alignment with the printed circuit, and simultaneously using the fastener to provide force to press physically compliant electrical contacts included in the circuit component housing assembly into electrical contact with terminal contact pads on the printed circuit. Several electronic circuit components may be housed in separate hermetically sealed cavities and can be biased independently of one another. Thermal conductors are included in the base member and a convection cooler is mounted atop the assembly. The mechanical fastener also acts as a thermal conductor. A test probe assembly including multiple contacts mounts on the electronic circuit component housing.

REFERENCES:
patent: 3271627 (1966-09-01), McDougal
patent: 3487267 (1969-12-01), Winston et al.
patent: 3789248 (1974-01-01), Jaecklin et al.
patent: 3984166 (1976-10-01), Hutchinson
patent: 4351580 (1982-09-01), Kirkman et al.
patent: 4390220 (1983-06-01), Bensutti
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patent: 4591896 (1986-05-01), Kikuchi
patent: 4624303 (1986-11-01), Nippert
patent: 4747017 (1988-05-01), Koors et al.
Larnerd et al., IC Package Assemblies, IBM Tech. Disc. Bull., vol. 21, #5, Oct. 1978, pp. 1817 & 1818 relied on.

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