Plating apparatus

Details Plating apparatus Plating apparatus

1982-09-08

1984-05-01

Tufariello, T. M.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204224R, C25D 1706, C25D 1728

Patent

active

044459920

ABSTRACT:
A plating apparatus for automatic plating of objects to be plated such as IC lead frames in a plural number in considerably high speed as a whole process line in which plural number of aligned object to be plated in the form of strips is conveyed laterally at a time on the conveyed line which is formed with aligning rollers group and the feed rollers group, while conveying, the objects to be plated are carried out pre-treatment and after-treatment, between both of treatments, the plating treatment is carried out by injection of plating liquid to the objects to be plated, and as loading a vacuum apparatus moving with arc-shaped track is employed for transferring plural objects to be plated in one on a conveyor line.

REFERENCES:
patent: 3391073 (1968-07-01), Rusch
patent: 3860499 (1975-01-01), Graham
patent: 4083755 (1978-04-01), Murata

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