Method of forming composite surface on a dielectric substrate

Details Method of forming composite surface on a dielectric substrate Method of forming composite surface on a dielectric substrate

1983-08-04

1984-05-01

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 181, 204 20, C25D 502, C25D 556

Patent

active

044459793

ABSTRACT:
A process for providing a dielectric substrate with a composite surface comprising a metal plated portion side-by-side an unplated portion. The process includes: depositing a metallic film over the surface of the substrate; removing a narrow band of the film to electrically isolate one portion of the film from another; immersing the substrate in an electroplating bath capable of dissolving the film; cathodizing one of the film portions in the bath to electroplate that portion while the other portion dissolves therein to expose the underlying substrate. The thusly exposed substrate may subsequently be painted.

REFERENCES:
patent: 2847370 (1958-08-01), Howard
patent: 3565770 (1971-02-01), Young
patent: 3591352 (1971-07-01), Kennedy
patent: 4170524 (1979-10-01), Nakajyo

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