Method of detecting defects in semiconductor package leads

Details Method of detecting defects in semiconductor package leads Method of detecting defects in semiconductor package leads

1994-11-17

2000-10-03

Mancuso, Joseph

Image analysis

Applications

Manufacturing or product inspection

G06K 900

Patent

active

061284041

ABSTRACT:
A method of detecting defects (14, 16, 17, 44, 47, 49, and 51) in objects is presented. A first grey level image (18) of a first object (10) is formed and a second grey level image (19) of a second object (12) is formed. The first (18) and second (19) grey level images are converted to a first (21) and a second (22) edge feature image, respectively. The first edge feature image is dilated (26) and the second edge feature image is skeletonized (27). The dilated (26) and skeletonized images (27) are compared. An alternate method includes forming a grey level image (40) of an object. A principal axis of the grey level image is identified, and a shifted grey level image is formed by shifting the grey level image a distance along the principal axis. The grey level image (40) is then compared to the shifted grey level image.

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