Stackable high density interconnection mechanism (SHIM)

Details Stackable high density interconnection mechanism (SHIM) Stackable high density interconnection mechanism (SHIM)

1992-04-20

1993-09-14

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174264, 29831, 361792, H05K 100

Patent

active

052451356

ABSTRACT:
A high density of interconnection sites on a dielectric substrate is provided by producing a laminated assembly with multiple layers of conductors (11, 21) positioned one above the other within the substrate (8). Each conductor (11, 21) terminates at a raised feature (12, 22) projecting beyond the surface of the substrate (8) for connection in an electrical circuit. This permits the conductors (11, 21) to be positioned in the same plane perpendicular to the substrate (8) so that two rows of termination pads (12, 22) may be provided without leaving space between the pads of one for the conductors of the other. Efficient, high speed impedance matching may be accomplished by the addition of a grounding conductor (26) between two signal layers of circuitry within the substrate, also provided with raised features (27) extending to the exterior of the substrate (8).

REFERENCES:
patent: 3516156 (1970-06-01), Sternko
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 4813129 (1989-03-01), Karnezos
patent: 4864722 (1989-09-01), Lazzarini et al.
patent: 4902606 (1990-02-01), Patraw
patent: 5121299 (1992-06-01), Frankeny et al.

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