Method and apparatus for producing a premolded packaging

Details Method and apparatus for producing a premolded packaging Method and apparatus for producing a premolded packaging

1982-03-31

1984-05-01

Goldberg, Howard N.

Geometrical instruments

29827, 29883, 174 52FP, H05K 100, H01R 4300

Patent

active

044457367

ABSTRACT:
A method is disclosed for forming a package for leadless integrated circuit substrates. Two identical webs of conductive material are formed into ladder like arrays of parallel terminals. One web has first housing portions formed on opposite ends of the terminals which are then formed on the housing portions. The second web is placed overlying the first web and between the first housing portions and second housing portions molded thereon integral with the first housing portions. The second terminals are then formed to finish the package.

REFERENCES:
patent: 3287795 (1966-11-01), Chambers
patent: 3389461 (1968-06-01), Hardardt
patent: 3574929 (1971-04-01), Michik
patent: 3693239 (1972-09-01), Dix
patent: 3798763 (1974-03-01), Deltoer
patent: 4079511 (1978-03-01), Grabbe
patent: 4142287 (1979-03-01), Grabbe
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4197636 (1980-04-01), Osanai
patent: 4225209 (1980-09-01), Hughes
patent: 4337574 (1982-07-01), Hughes et al.
patent: 4395084 (1983-07-01), Conrad

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