Self-aligned via structure

Details Self-aligned via structure Self-aligned via structure

1994-02-24

1995-11-28

Loke, Steven H.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257412, 257773, 257756, 257903, H01L 2348, H01L 2976, H01L 2352, H01L 2711

Patent

active

054710944

ABSTRACT:
A self-aligned via between interconnect layers in an integrated circuit allows a less precise masking alignment to be used to fabricate an integrated circuit with increased packing density and improved yield. In one embodiment, self-aligned vias are used to connect first and second interconnect layers in an SRAM memory cell.

REFERENCES:
patent: 4914056 (1990-04-01), Okumura
patent: 5189506 (1993-02-01), Cronin et al.

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