Patent
1990-10-03
1992-03-24
James, Andrew J.
357 52, 357 59, 357 65, 357 68, H01L 2348, H01L 2934, H01L 2904, H01L 2940
Patent
active
050993089
ABSTRACT:
A semiconductor device comprising one conductivity type semiconductor substrate, a reverse conductivity type diffusion layer, a semiconductor wiring layer and a metal connection wiring layer, and said metal connection wiring layer is composed of a high melting metal film formed by a selective CVD method.
REFERENCES:
patent: 4121240 (1978-10-01), Katto
patent: 4712291 (1987-12-01), McLevige
patent: 4903096 (1990-02-01), Masuoka et al.
patent: 4954871 (1990-09-01), Mizutani et al.
Deal Cynthia S.
James Andrew J.
NEC Corporation
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