1990-09-27
1992-03-24
Sikes, William L.
H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
050993070
ABSTRACT:
An optical sub-module comprises at least one optical connector; at least one optical operation element fixed to the optical connector; electronic circuit parts constituting an electronic circuit portion connected to the optical operation element; a substrate for supporting said electronic circuit parts; lead pins composed of inner leads and outer leads, inner leads being connected to electronic circuit portion; and a molding resin member holding the optical connector, the optical operation element, the electronic circuit parts, the substrate, and the lead pins in a body except for the outer leads of the lead pins and an end of the optical connector. An optical module comprises the sub-module and a molded receptacle having a first fitting portion into which the at least one optical connector is inserted so that the first fitting portion is fitted to the molding resin member, and a second fitting portion to which an optical plug holding the end of the optical fiber to be inserted in the optical connector, is fitted, the second fitting portion being communicated with the first fitting portion. The optical sub-module is formed through transfer molding.
REFERENCES:
patent: 4725692 (1988-02-01), Ishii et al.
patent: 4942455 (1990-07-01), Shinohara
patent: 4951120 (1990-08-01), Hagiwara et al.
patent: 5028986 (1991-07-01), Sugano et al.
Go Hisao
Matsumura Yutaka
Sikes William L.
Sumitomo Electric Industries Ltd.
Wise Robert E.
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