1983-07-27
1991-03-19
Hille, Rolf
357 67, H01L 2354, H01L 2352
Patent
active
050015460
ABSTRACT:
An integrated circuit assembly for electrical applications is disclosed. The assembly includes a lead frame formed from a composite structure. The composite structure comprises a substrate formed of a nickel-iron alloy. A cladding is bonded to opposite surfaces of the substrate. The cladding consists essentially of about 15% to about 70% nickel and the balance essentially copper. The resulting lead frame has a coefficient of thermal expansion of about 50 to about 100 in/in/.degree.C. A second embodiment of the integrated circuit assembly also relates to a lead frame formed from a composite structure. The composite structure comprises a substrate formed of a nickel-iron alloy. A cladding material is bonded to opposite surfaces of the substrate for providing the circuit assembly with relatively high electrical and thermal conductivity. A second cladding is bonded to opposite surfaces of the first cladding so that the lead frame has a coefficient of thermal expansion of about 50 to about 100 in/in/.degree.C. and a thermal conductivity of about 30 to 75 B.T.U./ft.sup.2 /ft/hr/.degree.F.
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Clark S. V.
Hille Rolf
Olin Corporation
Rosenblatt Gregory S.
Weinstein Paul
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