Process for manufacturing a metal pin grid array package

Details Process for manufacturing a metal pin grid array package Process for manufacturing a metal pin grid array package

1991-01-14

1992-03-24

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437209, 437224, 437211, H01L 2160

Patent

active

050988646

ABSTRACT:
A metal pin grid array package and a process for the assembly of the package is provided. The package includes a metal or metal alloy base component having an ordered array of holes. Terminal pins are electrically interconnected to a desired circuit and extend through the ordered array of holes. A dielectric polymer sealant bonds a cover component to both the circuit and to the base component. During package assembly, the polymer sealant flows into the holes comprising the ordered array of holes electrically isolating the terminal pins from the base component.

REFERENCES:
patent: 3735209 (1973-05-01), Saddler
patent: 3938178 (1976-02-01), Miura et al.
patent: 4233620 (1980-11-01), Darrow et al.
patent: 4322778 (1982-03-01), Barbour et al.
patent: 4338621 (1982-07-01), Braun
patent: 4382327 (1983-05-01), Bardens et al.
patent: 4461924 (1984-07-01), Butt
patent: 4480262 (1984-10-01), Butt
patent: 4561006 (1985-12-01), Currie
patent: 4618802 (1986-10-01), Schrank
patent: 4630096 (1986-12-01), Drye et al.
patent: 4777562 (1988-10-01), Carter
patent: 4816426 (1989-03-01), Bridges et al.
patent: 4822550 (1989-04-01), Komather
patent: 4823234 (1989-04-01), Konishi et al.
patent: 4827376 (1989-05-01), Voss
patent: 4849857 (1989-07-01), Butt et al.
patent: 4887148 (1989-12-01), Mu
patent: 4888449 (1989-12-01), Crane et al.
patent: 4890152 (1989-12-01), Hirata et al.
patent: 4901136 (1990-02-01), Neugebauer et al.
patent: 4926242 (1990-05-01), Itoh et al.
patent: 4939316 (1990-07-01), Mahulikar et al.
patent: 4939570 (1990-07-01), Bickford et al.
patent: 4965227 (1990-10-01), Chang et al.
patent: 4999319 (1991-03-01), Hamano et al.
patent: 5025347 (1991-06-01), Shindo et al.

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