Method of fabricating high-density interconnect structures havin

Details Method of fabricating high-density interconnect structures havin Method of fabricating high-density interconnect structures havin

1990-05-07

1992-03-24

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437189, 437192, 437198, 437230, 205118, 205122, H01L 2144

Patent

active

050988603

ABSTRACT:
A method of fabricating a high-density multilayer copper/polyimide interconnect structure utilizing a blanket tantalum/tantalum oxide layer that electrically connects all of the electroplating seed layers to the edge of the substrate; upon completion of the electroplating process, the excess tantalum/tantalum oxide layer is etched off to produce isolated conductor lines. A multilayer copper/polyimide interconnect structure may be fabricated by repeating this fabrication sequence for each layer.

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