Laser machining apparatus

Details Laser machining apparatus Laser machining apparatus

1998-10-20

2000-08-15

Evans, Geoffrey S.

Electric heating

Metal heating

By arc

21912168, 21912183, B23K 2636

Patent

active

061039918

ABSTRACT:
In a laser machining apparatus for performing a laser repair process on a semiconductor wafer, fuses are selectively melted based on the result of judging. A method for aligning a laser machining apparatus for applying a laser beam for laser machining, includes the steps of: detecting a position of a first specific point for alignment provided on an object-to-be-machined; computing a position of a second specific point for alignment other than the first specific point, based on a detected position of the first specific point; detecting a position of the second specific point; and comparing the computed position of the second specific point with the detected position of the second specific point. When the difference between both positions is above a preset threshold value, the laser machining is interrupted.

REFERENCES:
patent: 4769523 (1988-09-01), Tanimoto et al.
patent: 5414519 (1995-05-01), Han
patent: 5690846 (1997-11-01), Okada et al.

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