Pickup method and the pickup apparatus for chip-type part

Details Pickup method and the pickup apparatus for chip-type part Pickup method and the pickup apparatus for chip-type part

1990-12-07

1992-03-24

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156344, 1563796, 156584, 294265, B32B 3128

Patent

active

050985019

ABSTRACT:
The present invention has an object to provide a pickup method and the pickup apparatus for chip type part capable of storing a part of chip type part kept adhered with a sufficient adhesive strength on an adhesive layer such as an expanded tape for a storage purpose while the other part of chip type part is adhered on the adhesive layer for current use. In order to achieve the object, there is provided a pickup technique for chip type part wherein an energy beam is radiated on a part of adhesive layer fixing the chip type part.

REFERENCES:
patent: 4718967 (1988-01-01), Irie
patent: 4720317 (1988-01-01), Kuroda et al.
patent: 5037780 (1991-08-01), Fujimoto et al.

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