Semiconductors covered by a polymeric heat resistant relief stru

Details Semiconductors covered by a polymeric heat resistant relief stru Semiconductors covered by a polymeric heat resistant relief stru

1974-05-21

1976-04-27

James, Andrew J.

96 351, 96115R, H01L 2328

Patent

active

039538770

ABSTRACT:
Described are novel semiconductor structures having a protective passivating layer made from photo- or radiation cross-linking of selected reactive sites of a soluble pre-polymer which is a poly-addition or poly-condensation product of a polyfunctional carbocyclic and/or heterocyclic compound having reactive groups for condensation or addition as well as photoreactive or radiation-reactive groups capable of further polymerization or dimerization. Selected non-cross-linked portions of the passivating layer may be removed by dissolution to form contact points for various useful semiconductor and capacitor components.

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