Apparatus for polishing semiconductor wafers

Details Apparatus for polishing semiconductor wafers Apparatus for polishing semiconductor wafers

1985-09-23

1987-07-21

Schmidt, Frederick R.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

511313, 511315, 51326, 51283R, 51235, B24B 704

Patent

active

046808930

ABSTRACT:
An apparatus for polishing semiconductor material is described in which a movable polishing arm is mounted to a cabinet. Connected to the polishing arm is a workpiece holder or sometimes referred to as a wafer chuck. Adjacent to the polishing arm is a load station which positions the wafer for pick-up by the polishing arm and attached wafer chuck. Mounted to the cabinet, next to a brush station, is a primary polish station which is used to remove the majority of the material. Alongside of the primary polish station is a final polish station used to provide a finished surface to the wafer. The polishing arm discharges the polished wafer into an unload station which is located next to the final polish station.

REFERENCES:
patent: 3858369 (1975-01-01), Dolgov et al.
patent: 4002246 (1977-01-01), Brandt et al.
patent: 4141180 (1979-02-01), Gill, Jr. et al.
patent: 4239567 (1980-12-01), Winnings
patent: 4484413 (1985-10-01), Yamamoto et al.

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