Thick-film circuit element

Details Thick-film circuit element Thick-film circuit element

1995-07-11

1997-12-30

Ryan, Patrick

Plastic and nonmetallic article shaping or treating: processes

Including step of generating heat by friction

264 60, 156 89, 427 96, 427101, 427102, 427125, 428901, C04B 3334

Patent

active

057026530

ABSTRACT:
A thick-film switch element includes a high-temperature glass frit fused to a non-conductive substrate. A cermet layer having a low-temperature glass matrix is fired in a conventional furnace to sink into the glass frit layer such that the resulting thickness of the switch element layer is approximately equal to the original thickness of the glass frit layer. The wet print thickness of the cermet layer is controlled upon application of the cermet to the glass frit. The glass frit and cermet are fired at a controlled temperature and duration to achieve a fired print thickness of the cermet above the surface of the glass frit having a pre-determined value. In one embodiment, the non-conductive substrate is a metal, such as stainless steel.

REFERENCES:
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patent: 4824694 (1989-04-01), Bosze et al.
patent: 4839775 (1989-06-01), Schnitker et al.
patent: 5024883 (1991-06-01), SinghDeo et al.
patent: 5039552 (1991-08-01), Riemer
patent: 5169465 (1992-12-01), Riley
patent: 5378408 (1995-01-01), Carroll

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