Method for manufacturing a base of a semi-conductor device

Details Method for manufacturing a base of a semi-conductor device Method for manufacturing a base of a semi-conductor device

1978-01-24

1980-03-11

Crane, Daniel C.

Metal working

Method of mechanical manufacture

Electrical device making

29879, 29882, 29592R, 29DIG47, 228155, 174 52H, 357 81, 72258, H01R 904, H01R 4300

Patent

active

041920635

ABSTRACT:
A method for manufacturing a base of a semiconductor device is made up of the steps of silver soldering a metal ring of weldable and extrudable material on a metal blank of thermally and electrically conductive material to thereby form a base body; and thereafter extruding the base body so as to form a generally complete base. When the base body is extruded, a raised portion for mounting a semiconductor pellet thereon and a stud to be threaded are formed on the upper and lower surfaces of the base body, respectively and at the same time, an annular projection, which is used as a projection to weld to the upper surface of the base a shell to cover the semiconductor pellet, is formed on the upper surface of the metal ring.

REFERENCES:
patent: 2966987 (1961-01-01), Kaul
patent: 3197843 (1965-08-01), Nippert
patent: 3199000 (1965-08-01), Nippert
patent: 3279039 (1966-10-01), Nippert
patent: 3348297 (1967-10-01), Dijkmeijer
patent: 3918625 (1975-11-01), Nippert
patent: 4124935 (1978-11-01), Sato

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