Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor
Patent
1993-04-14
1994-11-22
Karlsen, Ernest F.
Electricity: measuring and testing
Measuring, testing, or sensing electricity, per se
With rotor
324754, G01R 3102
Patent
active
053672534
ABSTRACT:
Disclosed is a technique for testing a singularized semiconductor die prior to packaging the die, thereby allowing for the packaging or other use of only known good die. The invention employs a carrier tray which preferably supports several die carriers which individually support a plurality of dies. Bridge clamps press against rigid covers which bias the dies against the contact members. The die carriers include a housing of ceramic or other workable material. Contact pads on the interior of the package are coupled to exterior leads with conductive traces. The back side of a semiconductor die to be tested is removably mounted to a lid, and the bond pads on the die are aligned with the contact pads on the interior of the package. The lid is attached to the package thereby electrically coupling the contact pads with the bond pads on the die. The package has a configuration which facilitates the handling of the carrier so that the carrier can be conveniently used during burn-in and test procedures.
REFERENCES:
patent: 4683425 (1987-07-01), Tossutto et al.
patent: 4783719 (1988-11-01), Jamison et al.
patent: 4899107 (1990-02-01), Corbett et al.
"IC Socket Takes Chip Carriers"; Electronics; Nov. 11, 1976; pp. 152, 154.
"Shipper-Tester-IC Flat Packs"; Azimuth Electronics, Route 10, Denville, Minn.; 1 page.
"Known-Good Die: A Key to Cost-Effective MCMs", Cloud et al., Electronic Packaging and Production, Sep. 1992.
Military SRAM Die, Micron Military Products Data Book, 1992, pp. 61-614.
Micron Known-Good Die Brochure.
"Our Computer Revealed, Inside the Processor" p. 139, Macworld, Oct., 1992.
Farnworth Warren M.
Hembree David R.
Wood Alan G.
Fox III Angus C.
Karlsen Ernest F.
Micron Semiconductor Inc.
Protigal Stanley N.
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