Automatic jet soldering apparatus

Details Automatic jet soldering apparatus Automatic jet soldering apparatus

1989-08-30

1991-01-01

Heinrich, Sam

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228 43, B23K 306

Patent

active

049812491

ABSTRACT:
An automatic jet soldering apparatus comprising: a solder bath for holding molten solder therein; a nozzle body having an open top and an open bottom through which the molten solder rises from the solder bath; a punched panel having numerous holes and disposed inside of the nozzle body in such a way to be opened and closed; and a jet source connected to the lower part of the nozzle body, the molten solder rising upward through the nozzle body via the open bottom and the open top of the nozzle body by means of jet power from the jet source. The soldering apparatus further comprises a back rectifying plate mounted on the rear portion of the top opening of the nozzle body, the sloping angle of the back rectifying plate being adjustable, thereby attaining an easy removal of solder residues from the punched panel and achieving a zero relative speed between a printed circuit board and the solder flow velocity, so that the reliability of soldering can be enhanced.

REFERENCES:
patent: 4465219 (1984-08-01), Kondo
patent: 4666077 (1987-05-01), Rahn et al.

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