Semiconductor device including a thermal fuse encapsulated in a

Details Semiconductor device including a thermal fuse encapsulated in a Semiconductor device including a thermal fuse encapsulated in a

1977-12-29

1979-09-25

James, Andrew J.

Geometrical instruments

357 70, 357 72, 357 76, 357 81, 339275C, H01L 2702, H01L 2348, H01L 2944

Patent

active

041692713

ABSTRACT:
A semiconductor device of this invention comprises a semiconductor chip including a high power consumption portion, an internal lead wire connecting an electrode portion of the semiconductor chip with an external terminal, a soft material adhered to a substantially middle portion of the lead wire, and a moulding material for integrally moulding the semiconductor chip, lead wire, and soft material. Further, the semiconductor device includes a thermal fuse to prevent flaming of the device by cutting off the lead wire within the soft material in case the device is subjected to overcurrent.

REFERENCES:
patent: 2979644 (1961-04-01), Salzer
patent: 3451609 (1969-06-01), Gillett
patent: 3777297 (1973-12-01), Knapp
patent: 3832606 (1974-08-01), Furnival
patent: 3974105 (1976-08-01), Sato et al.

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