Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-06-05
1997-08-26
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29830, 29842, 22818022, H01R 900, H05K 300
Patent
active
056599536
ABSTRACT:
An apparatus comprising a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire extending into the well and being in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire from a device into the well such that the lead or wire is in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate.
REFERENCES:
patent: 3337838 (1967-08-01), Damiano et al.
patent: 3366915 (1968-01-01), Miller
patent: 3444506 (1969-05-01), Wedekind
patent: 3516156 (1970-06-01), Steranko
patent: 3875479 (1975-04-01), Jaggar
patent: 4487463 (1984-12-01), Tillotson
patent: 4572604 (1986-02-01), Ammon et al.
patent: 4616406 (1986-10-01), Brown
patent: 4655526 (1987-04-01), Shaffer
patent: 4698663 (1987-10-01), Sugimoto et al.
patent: 4734042 (1988-03-01), Martens et al.
patent: 4787853 (1988-11-01), Igarashi
patent: 4897055 (1990-01-01), Jurista et al.
patent: 4943846 (1990-07-01), Shirling
patent: 4959750 (1990-09-01), Cnyrim et al.
patent: 4975066 (1990-12-01), Sucheski et al.
patent: 4997376 (1991-03-01), Buck et al.
patent: 5037311 (1991-08-01), Frankeny et al.
patent: 5048178 (1991-09-01), Bindra et al.
patent: 5071363 (1991-12-01), Reylek et al.
patent: 5081563 (1992-01-01), Feng et al.
patent: 5098305 (1992-03-01), Krajewski et al.
patent: 5117069 (1992-05-01), Higgins, III
patent: 5123164 (1992-06-01), Shaheen et al.
patent: 5137456 (1992-08-01), Desai et al.
patent: 5281151 (1994-01-01), Arima et al.
patent: 5309024 (1994-05-01), Hirano
patent: 5326936 (1994-07-01), Taniuchi et al.
patent: 5334279 (1994-08-01), Gregoire
patent: 5342999 (1994-08-01), Frei et al.
patent: 5351393 (1994-10-01), Gregoire
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5376825 (1994-12-01), Tukamoto et al.
patent: 5390412 (1995-02-01), Gregoire
patent: 5419038 (1995-05-01), Wang et al.
patent: 5499445 (1996-03-01), Boyle et al.
IBM Technical Disclosure Bulletin, "Mounting Technique For Surface Components," vol. 31, No. 7, Dec. 1988.
George D. Gregoire, "3-Dimensional Circuitry Solves Fine Pitch SMT Device Assembly Problem;" Connection Technology.
Dimensional Circuits Corporation, "Dimensional Circuits Corp." Awarded Two U.S. Patents, D.C.C. News, Apr. 5, 1994.
George D. Gregoire, "Very Fine Line Recessed Circuitry--A New PCB Fabrication Process".
Robert Barnhouse, "Bifurcated Through-Hole Technology--An Innovative Solution to Circuit Density," Connection Technology, pp. 33-35 (Feb., 1992).
"AMP-ASC Interconnection Systems," AMP Product Information Bulletin, pp. 1-4 (1991).
"Micor-Strip Interconnection System," AMP Product Guide, pp. 3413-3414 (Jun., 1991).
"Rib-Cage II Through-Mount Shrouded Headers" and Micropax Board-to-Board Interconnect System, Du Pont Connector Systems Product Catalog A, pp. 2-6, 3-0, 3-1 (Feb., 1992).
R.R. Tummala et al., "Microelectronics Packaging Handbook," Van Nostrand Reinhold, 1989, pp. 38-43, 398-403, 779-791, 853-859, and 900-905.
"Packing," Intel Corporation, 1993, pp. 2-36, 2-96, 2-97, 2-100, 3-2, 3-24, and 3-25.
Crane, Jr. Stanford W.
Portuondo Maria M.
Arbes Carl J.
The Panda Project
LandOfFree
Method of manufacturing an apparatus having inner layers support does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing an apparatus having inner layers support, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing an apparatus having inner layers support will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1980649