Wiring board with an insulating layer to prevent gap formation d

Details Wiring board with an insulating layer to prevent gap formation d Wiring board with an insulating layer to prevent gap formation d

1995-06-13

2000-10-03

Gaffin, Jeffrey

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 174252, H01R 909

Patent

active

061276340

ABSTRACT:
A wiring board structure includes a board made of a material which can be etched by a given solution, an electrically conductive portion, which is thermally conductive, having a portion which extends from the board and which can be etched by the given solution, and an insulating layer having a portion which is in contact with the board and only the side surface of the electrically conductive portion and which prevents the board from being etched when the electrically conductive layer is etched.

REFERENCES:
patent: 4729061 (1988-03-01), Brown
patent: 5461197 (1995-10-01), Hiruta et al.
patent: 5471366 (1995-11-01), Ozawa
patent: 5473120 (1995-12-01), Ito et al.
patent: 5506755 (1996-04-01), Miyagi et al.

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