Electronic device for offsetting adverse effects of a plurality

Details Electronic device for offsetting adverse effects of a plurality Electronic device for offsetting adverse effects of a plurality

1995-05-10

1997-02-25

Phillips, Michael W.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361719, 257717, 257748, H05K 720, H01L 2336

Patent

active

056064870

ABSTRACT:
An electronic device is formed by connecting a wiring plate and insulating plates mounting semiconductor chips to a base. A composite material plate, which is made by combining materials having different linear thermal expansion coefficients, is inserted between the base and the insulating plates through solders. The thickness ratio (h.sub.a /h.sub.b) of the materials of the composite material plate is selected in such a manner that strain in the solder between the base and the composite material plate is equal to the strain in the solder between the insulating plate and the composite material plate. In accordance with one embodiment of the invention, a single insulating plate is provided for mounting a plurality of semiconductor chips. The single insulating plate and the wiring plate, are arranged relative to one another on the base so that the centers of the single insulating plate and of the wiring plate are aligned with one another along a line corresponding to an axis of the single insulating plate and perpendicular to the width direction thereof. This serves to reduce the shift of the centers which might otherwise occur due to thermal deformation.

REFERENCES:
patent: 4427993 (1984-01-01), Fichot et al.
patent: 4556899 (1985-12-01), Kurihara et al.
patent: 4811166 (1989-03-01), Alvarez et al.
patent: 4878152 (1989-10-01), Sauzade et al.
patent: 4907125 (1990-03-01), Drekmeier et al.

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