Heat resistant adhesive film, an adhesion structure, and method

Details Heat resistant adhesive film, an adhesion structure, and method Heat resistant adhesive film, an adhesion structure, and method

1994-04-06

1996-11-26

Seidleck, James J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

528125, 528128, 528170, 528172, 528173, 528174, 528176, 528183, 528188, 528220, 528229, 528350, 428458, 4284735, C08G 7310, C08G 6926

Patent

active

055786960

ABSTRACT:
A heat-resistant adhesive film, an adhesion structure obtained using the same, and an adhesion method using the same are disclosed, the film comprising a polyisoimide resin containing at least 40 mol % of an isoimide unit represented by formula (I): ##STR1## wherein R.sub.1 represents a tetravalent aromatic or aliphatic residue; R.sub.2 represents a divalent aromatic or aliphatic residue; and the arrow represents a bond replaceable on isomerization, in the molecule thereof. The isoimide unit of the polyisoimide resin is easily converted to an imide unit on heating, e.g., hot pressing with an adherend, to provide a cover-lay film or a single-sided or double-sided base for printed circuit boards having excellent adhesion, heat resistance, dimensional precision, and workability.

REFERENCES:
patent: 4496711 (1985-01-01), Landis
patent: 4613637 (1986-09-01), Landis et al.
patent: 4699841 (1987-10-01), Kundinger et al.
patent: 4705720 (1987-11-01), Kundinger et al.
patent: 5306741 (1994-04-01), Chen et al.

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