Method of manufacturing GaAs metal semiconductor field effect tr

Fishing – trapping – and vermin destroying

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437 22, 437161, 437184, 437912, H01L 21265

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053148339

ABSTRACT:
A method of manufacturing a GaAs field effect transistor comprises depositing a silicon thin film 202 on a semi-insulating semiconductor substrate 201, forming a first sensitive film 203 by a photolithography to define channel areas and ion-implanting n-type dopants into the substrate to form an activation layer, removing the first sensitive film, forming a second sensitive film 203a on the silicon thin film by photolithography to define an ohmic contact area and then forming a highly doped impurity layer on the side of the activation layer by way of an ion-implantation process, depositing a passivation film 206 over the entire surface of the substrate 201 after the removal of the sensitive film, and effecting an annealing or heat treatment, forming a third sensitive film of a predetermined pattern by using an ohmic contact forming mask, effecting a recess etching process to the surface of the substrate and forming an ohmic contact on the etched portion, and patterning a gate region by using the gate forming mask, recess-etching the surface of the substrate and depositing a low resistivity metal to form a gate.

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patent: 4728621 (1988-03-01), Graf et al.
patent: 4732871 (1988-03-01), Buchmann et al.
patent: 4849368 (1989-07-01), Yamashita et al.
patent: 4929567 (1990-05-01), Park et al.
patent: 5073512 (1991-12-01), Yoshino

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