Method of producing a head for the printer

Details Method of producing a head for the printer Method of producing a head for the printer

1995-07-13

1997-12-16

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

216 27, 347 65, H05B 300

Patent

active

056971443

ABSTRACT:
To provide a method of fabricating, using thin-film processes only, a 1,600 dpi head with nozzles arranged two-dimensionally on a substrate, e.g., silicon wafer, a drive LSI, thin-film resistors and thin-film conductors are formed on the silicon wafer. Thereafter, ink channels and through-holes are formed by silicon anisotropic etching from both sides of the silicon wafer. After connecting the orifice plate to the silicon wafer, nozzles are formed in the orifice plate using photoetching.

REFERENCES:
"Design and Development of a Color Thermal Inkjet Print Cartridge"; Jeffrey P. Baker et al.; Hewlett-Packard Journal; Aug. 1988.
Nikkei Mechanical, Dec. 28, 1992 edition, pp. 58-63.

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