Method of applying metallized contacts to a solar cell

Fishing – trapping – and vermin destroying

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437 2, 437 8, 437180, 437245, 101150, 101163, 101170, 136256, H01L 2144, H01L 2148

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active

051513862

ABSTRACT:
A method of applying metallized contacts to the surfaces of semiconductor substrates using a conventional pad printing device. Standard screen printing inks diluted 2-30 weight percent with an appropriate solvent have been satisfactorily used to accomplish the method. For certain contact configurations, portions of the surface of the substrate are covered with a Mylar mask during the pad printing process. The method makes it possible to form a metallized contact having a uniform thickness on an uneven substrate surface, e.g., the surface of a silicon substrate produced by the EFG method.

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Imtran Industries Inc. Brochure entitled "Imtran 150 Series Pad Transfer Printing Machine".
Imtran Industries Inc. publication entitled "History of Pad Printing".
Tampoprint America Inc. brochure entitled "Pad Printing".
Ghandhi, VLSI Fabrication Principles, Wiley-Interscience Publication, New York, 1983, p. 2.
Heinz Groh, "Pad Printing Impresses the Plastics Industry", Plastics Engineering, Jun. 1987, pp. 39-41.
G. W. Scott, Jr., "A Look at the Changes in Semiconductor Device Printing/Marketing", Microelectronic Manufacturing and Testing, Aug. 1988.
S. Duccilli, "Pad Printing", Screen Printing, Apr. 1989, pp. 62-70 and 152.

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