Method of making top buss virtual phase frame interline transfer

Details Method of making top buss virtual phase frame interline transfer Method of making top buss virtual phase frame interline transfer

1991-08-19

1992-09-29

Thomas, Tom

Fishing, trapping, and vermin destroying

437 26, 437 50, H01L 2170

Patent

active

051513803

ABSTRACT:
In one embodiment of the invention, a method for fabricating a virtual phase image sensor is disclosed comprising the steps of forming a semiconductor substrate of a first conductivity type, forming a buried channel region of a second conductivity type in the substrate, forming a virtual gate of the first conductivity type at a surface of the buried channel region, implanting channel stop regions of the first conductivity type in the virtual gate, the channel stop regions contacting the buried channel, and forming a conductive contact on an upper surface of the channel stop regions wherein the conductive contact is additionally coupled to the substrate. In another embodiment of the invention, a method for fabricating a virtual phase image sensor is disclosed comprising the steps of forming a semiconductor substrate of a first conductivity type, forming a buried channel region of a second conductivity type, forming a gate insulator layer on the buried channel, selectively forming a conductive gate region on the gate insulator, depositing and patterning a masking layer on the conductive gate and the gate insulator such that a portion of an edge of the conductive gate and the gate insulator such that a portion of an edge of the at least one conductive gate is exposed by the masking layer pattern, and implanting a channel stop region of the first conductivity type in the buried channel in areas exposed by the masking layer pattern, whereby a side of the channel stop region is self-aligned to the portion of an edge of the conductive gate.

REFERENCES:
patent: 4488165 (1984-12-01), Levine
patent: 4642877 (1987-02-01), Garner et al.
patent: 4660090 (1987-04-01), Hynecek
patent: 4668971 (1987-05-01), Hynecek
patent: 4673963 (1987-06-01), Hynecek
patent: 4992392 (1991-02-01), Nichols et al.

Affiliated with

Also associated with

Rating

Method of making top buss virtual phase frame interline transfer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making top buss virtual phase frame interline transfer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making top buss virtual phase frame interline transfer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1968235