Thick film conductor compositions

Details Thick film conductor compositions Thick film conductor compositions

1983-08-25

1985-04-30

Barr, Josephine L.

Compositions

Electrically conductive or emissive compositions

Free metal containing

252514, 106 112, 106 114, 106 115, 106 113, 106 118, 106 119, 106 121, H01B 106

Patent

active

045143218

ABSTRACT:
A copper-containing thick film conductor composition comprising a mixture of finely divided particles of (a) a conductive material containing copper metal, (b) inorganic binder and (c) 0.2-5% wt. of a noncuprous metal selected from the group consisting of tungsten, molybdenum, rhenium and alloys and mixtures thereof all dispersed in organic medium. The metal particles must be within certain narrow ranges of particle size.

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patent: 4379195 (1983-04-01), Prabhu et al.
patent: 4400214 (1983-08-01), Ogawa et al.
patent: 4415624 (1983-11-01), Prabhu et al.
U.S. Ser. No. 505,730, 7/83, Siuta.

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