Method of packaging a semiconductor device

Details Method of packaging a semiconductor device Method of packaging a semiconductor device

1995-06-05

1996-11-26

Heinrich, Samuel M.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

2281246, H01L 2310, H01L 2152

Patent

active

055776566

ABSTRACT:
A compact package and a method of hermetically packaging a high power semiconductor device includes a metal lid bonded to a ceramic base with the semiconductor device therebetween. The lid is bonded to one surface of the device, and electrical contacts on the opposing surface of he device are bonded to foils that seal openings in the base for contact pins.

REFERENCES:
patent: 5018002 (1991-05-01), Neugebauer et al.
patent: 5103290 (1992-04-01), Temple et al.

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