1991-03-06
1992-10-20
James, Andrew J.
357 68, 357 65, 357 80, H01L 2348
Patent
active
051574764
ABSTRACT:
A tape carrier body is provided with a mounting portion on which a semiconductor integrated circuit is mounted and a plurality of test pads which are disposed away from the mounting portion. The semiconductor integrated circuit is provided with a power supply pad to which a supply voltage is applied and a plurality of signal pads for inputting and outputting signals, the number of the test pads being larger than the total number of the power supply pad and the signal pads. The signal pads of the semiconductor integrated circuit and the test pads of the tape carrier body are connected by outer leads. The power supply pad of the semiconductor integrated circuit and outside test pad of the test pads of the tape carrier body are connected by an outer lead.
REFERENCES:
patent: 4411719 (1983-10-01), Lindberg et al.
patent: 4575747 (1986-03-01), Fritz
patent: 4772936 (1988-09-01), Reding et al.
patent: 4806409 (1989-02-01), Walter et al.
James Andrew J.
Kabushiki Kaisha Toshiba
Nguyen Viet Q.
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