Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Patent
1998-02-18
2000-10-24
Utech, Benjamin L.
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
438748, 134 25, H01L 21302
Patent
active
061367249
ABSTRACT:
An apparatus and method for performing multiple wet processing steps on objects placed within a sealed chamber. The apparatus include a sealable chamber, at least one processing tank within the chamber, and preferably also includes an intrachamber robot configured to move objects to be treated within the chamber. Preferred embodiments utilize at least two processing tanks within the chamber. During use of these exemplary embodiments, objects to be treated are placed within the sealed chamber and the chamber is sealed to create a sealed interior environment. The objects are immersed in a first treatment fluid which is in a first one of the tanks, and then carried by the intrachamber robot from the first to the second tank where there are immersed in a second treatment fluid in the second tank. The objects may be moved back and forth between the tanks as needed in order to complete the process being performed. After processing is complete, the chamber is unsealed and the objects are removed from the chamber. In a preferred method, processing fluids are drained from the tanks at some point prior to the unsealing of the chamber in order to substantially prevent passage of fumes to the outside environment or contaminants from the exterior environment.
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Becia William Warren
Hall Randy Mark
Hansen Eric T.
Ives Thomas Wayne
Krawzak Tom
Chen Kin-Chan
SCP Global Technologies
Utech Benjamin L.
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