Multiple wavelength laser arrays by flip-chip bonding

Details Multiple wavelength laser arrays by flip-chip bonding Multiple wavelength laser arrays by flip-chip bonding

1998-05-06

2000-10-24

Elms, Richard

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

372 50, H01L 2100

Patent

active

061366234

ABSTRACT:
This invention relates to a multiple wavelength laser structure, and more particularly, to a multiple wavelength laser array structure fabricated by flip-chip bonding from laser structures on two different substrates. A side by side red/IR laser structure is flip-chip bonded to a blue laser structure to form a red/blue/IR hybrid integrated laser structure.

REFERENCES:
patent: 5150372 (1992-09-01), Abramov et al.
patent: 5384797 (1995-01-01), Welch et al.
patent: 5640188 (1997-06-01), Andrews
patent: 5644586 (1997-07-01), Kawano et al.
patent: 5920766 (1999-07-01), Floyd
patent: 5999553 (1999-12-01), Sun

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