Thermal conductivity cell with thick film seal

Measuring and testing – Gas analysis – By vibration

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

277DIG6, G01N 3100

Patent

active

041701267

ABSTRACT:
A thermal conductivity cell is provided that is made of cast wafers of ceramic material having a groove in one or both planar abutting surfaces. A filament is mounted in the groove by attachment to the ends of electrical conductors that extend through one of the wafers in sealed relationship. Passageways extend between points in the groove and an exterior surface of the cell. Gaskets are formed on the exterior surface around the openings where the passageways emerge. The gaskets are formed by silk screening and firing one or more layers of thick film conductor paste onto the surface of a layer of thick film conductor paste and at least one superimposed layer of gold and binder.

REFERENCES:
patent: 3154503 (1964-10-01), Rao et al.
patent: 3888110 (1975-06-01), Clark

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermal conductivity cell with thick film seal does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal conductivity cell with thick film seal, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal conductivity cell with thick film seal will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1961470

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.