1987-01-15
1989-10-10
Sikes, William L.
H01L 2302, H01L 2312
Patent
active
048735663
ABSTRACT:
A multilayer ceramic package for optical devices is disclosed for use in both high and low bit rate applications. A side portion of the multilayer package is formed to provide a multilayer microwave input connection for a high bit rate signal. In an exemplary arrangement, an intermediate ceramic layer of the multilayer structure is defined with an appropriate thickness and metallized on areas of the top and bottom surfaces. This combination thus forms a multilayer microwave connection defined as a microstrip. Other multilayer configurations, for example, a stripline, may also be used. By utilizing a multilayer microwave connection in place of a conventional electrical connection, the impedance of the high frequency input source can be better matched to the optical device.
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Hokanson John L.
Smeltz, Jr. Palmer D.
Yanushefski Katherine A.
Yanushefski Michael J.
Young Craig A.
American Telephone and Telegraph Company
AT&T Bell Loboratories, AT&T Technologies Inc.
Koba W. W.
Sikes William L.
Wise Robert E.
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