Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Patent
1996-02-08
1998-05-26
Picardat, Kevin
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
438117, 438611, 438 52, H01L 2166
Patent
active
057563705
ABSTRACT:
A compliant contact system for making a temporary electrical connection with a semiconductor die for testing and a method for fabricating the compliant contact system are provided. The compliant contact system is adapted for use with a test apparatus for known good die. The compliant contact system includes an interconnect, and can include an alignment fixture for aligning the die with the interconnect. The interconnect includes a pattern of compliant contacts adapted to contact the bond pads on the die. The compliant contacts are formed as metal traces on a silicon substrate. The end portions of the metal traces are cantilevered over a pit etched into the substrate, and are adapted to flex to compensate for dimensional variations in the bond pads and to provide a bias force against the bond pads.
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Akram Salman
Farnworth Warren M.
Gratton Stephen A.
Micro)n Technology, Inc.
Picardat Kevin
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