Method of manufacturing MOS-type semiconductor device having ele

Fishing – trapping – and vermin destroying

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437 41SW, 437 44, 437233, 437 34, 437 57, H01L 218234, H01L 218238

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active

057563659

ABSTRACT:
In a semiconductor device, an n.sup.+ -type polysilicon layer is formed on a substrate through a gate oxide layer. A p.sup.+ -type source or drain diffusion layer is formed on both sides of an impurity layer in the substrate. The n.sup.+ -type polysilicon layer is positioned over an intermediate portion of a channel formation layer, and has an oxide layer on an upper surface thereof. The n.sup.+ -type polysilicon layer has at its side portions a p.sup.+ -type polysilicon layer to make a gate electrode together with the n.sup.+ -type polysilicon layer. The gate electrode semiconductor layer is formed on the channel formation layer through the gate insulation layer in such a manner that in a portion contacting with the gate insulation layer, the nearer the portion approaches the impurity layers of the source and drain regions, the larger the work function of the portion becomes.

REFERENCES:
patent: 5061647 (1991-10-01), Roth et al.
patent: 5087582 (1992-02-01), Campell et al.
patent: 5202276 (1993-04-01), Malhi
patent: 5279979 (1994-01-01), Shino et al.

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