Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1988-06-16
1989-10-10
Powell, William A.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
156656, 1566591, 156668, 156902, 204 30, 427 96, 427 98, 427304, 427307, 428458, 4284744, 428601, 428626, 428901, B32B 300, B32B 700, B44C 122, H05K 100
Patent
active
048731366
ABSTRACT:
An improved method for pretreating a polyimide surface in preparation for an adhesion promotion treatment and subsequent metallization is disclosed, wherein the pretreatment comprises mild etching of the surface, contact of the surface with a basic solution, and contact of the surface with a cationic surfactant which is capable of removing a residual film formed on the surface after the mild etching step. This invention further includes articles such as printed circuit boards, which comprise a polyimide substrate pretreated as described above and then treated with an adhesion promoter, wherein an electrolessly-applied metal layer is disposed on the substrate, and an electrolytically-applied metal layer free of chemical additives is disposed on the electrolessly-applied layer. The article may include an additional electrolytically-applied layer containing chemical additives and disposed on top of the first electrolytic layer.
REFERENCES:
patent: 4517254 (1985-05-01), Grapentin et al.
patent: 4528245 (1985-07-01), Jobbins
patent: 4775449 (1988-10-01), Dumas et al.
patent: 4790912 (1988-12-01), Holtzman et al.
IBM Technical Disclosure Bulletin, Sep. 1986, vol. 29, No. 4, p. 1708.
Chemical and Engineering News, "Functional Groups Put On Polymer Surfaces", Sep. 22, 1986, pp. 27-28.
Chemical Abstracts, Ger. Offen. DE 3,612,822, Mahlkow, 108: 132996n, "Metallization of Polyether-Polyimides with Good Adhesion".
The Iron Age, Jul. 27, 1950, "Plating Range Tests Improve Plating Baths", Mohler, pp. 63-64.
Printed Circuit Fabrication, Jacobi, "Molded Wiring Board Materials and Processes", vol. 9, No. 7, Jul. 1986, pp. 50-61.
Zhur. Prik. Khim., Engl. Ed. 59, Vorob'eva et al. (1986), pp. 508-513.
Printed Circuit Fabrication, Carano, "Acid Copper Plating of High Aspect Ratio MLBs", vol. 9, No. 12, Dec. 1986, pp. 34-47.
Dumas William V.
Foust Donald F.
Jerabek Elihu C.
Karas Bradley R.
Lamby Edward J.
Davis Jr. James C.
General Electric Company
Pittman William H.
Powell William A.
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