Solder containing electrical connector and method for making sam

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

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439874, H01R 909

Patent

active

048728462

ABSTRACT:
An electrical connector (10; 10'; 10") includes a housing (11) that defines a solder element receiving channel (20). A solder element (24) is disposed within the channel (20), and a conductive pin (28; 28') is mounted in the housing (11) to pass through the channel (20) and the solder element (24). The channel (20) defines a loading axis (22) angled with respect to the pin (28; 28'), and the channel (20) is shaped to receive the solder element (24) along the loading axis (22) and positively to retain the solder element (24) from movement along the pin (28; 28'). The pin (28; 28') prevents the solder element (24) from moving along the loading axis (22) out of the channel (20). Several methods for assembling such electrical connectors (10; 10'; 10") are described, and in these methods the solder element (24) is moved along the loading axis (22) into the channel (20) within the housing (11), and then the pin (28; 28') is moved into the housing (11) through the pin receiving aperture (16) and through the solder element (24) in order to stake the solder element (24) in place and prevent it from moving out of the channel (20) along the loading axis (22).

REFERENCES:
patent: 1188055 (1916-06-01), Faile
patent: 2776008 (1957-01-01), Soderman
patent: 3184830 (1965-05-01), Lane et al.
patent: 3214827 (1965-11-01), Phohofsky
patent: 3462540 (1969-08-01), Harris, Jr. et al.
patent: 3525799 (1970-08-01), Ellis
patent: 3568554 (1971-03-01), Wiechec
patent: 3591922 (1971-07-01), Pardee
patent: 3744129 (1973-07-01), Dewey, Jr.
patent: 3822622 (1974-07-01), Smith et al.
patent: 3834015 (1974-09-01), Di Renzo
patent: 3864014 (1975-02-01), Lynch
patent: 3905665 (1975-09-01), Lynch et al.
patent: 3932934 (1976-01-01), Lynch et al.
patent: 3978569 (1976-09-01), Cobaugh et al.
patent: 3997237 (1976-12-01), White
patent: 4019803 (1977-04-01), Schell
patent: 4120558 (1978-10-01), Seidler
patent: 4164064 (1979-08-01), Reavill
patent: 4203648 (1980-05-01), Seidler
patent: 4206542 (1980-06-01), Reavill
patent: 4216350 (1980-08-01), Reid
patent: 4500149 (1985-02-01), Mackay
patent: 4592617 (1986-06-01), Seidler
patent: 4641426 (1987-02-01), Hartman et al.
patent: 4655517 (1987-04-01), Bryce
patent: 4663815 (1987-05-01), Hartman et al.
patent: 4678250 (1987-07-01), Romine et al.
patent: 4679889 (1987-07-01), Seidler
patent: 4712721 (1987-12-01), Noel et al.
The Western Electric Engineer, vol. 19, No. 2 (1975) by T. Y. Chu, J. C. Mollendorf and G. M. Wenger.
IEEE Publication No. 73CHO 777-3EI (1973), Proceedings of the 11th Electrical Insulation Conference, pp. 242-245.
Alphametals, Inc. Document S/M-139 (1979), pp. 7-9.
"Duflo" Header System by Ray Doutrich, Sep. 26, 1986, pp. 2-4.
New Duflo Headers, Dupont Connector Systems (1987).
Vapor-Phase Quickie Headers, Dupont Connector Systems (1986), pp. 2-7.
Surface-Mount Connectors Use Solder Inlays, Circle No. 230, p. 38.
Molex Catalog No. 830, p. 7J.
EPO STD Search Report and Annex File: RS 80717US; RS 80718US.
Standard Search Report DTD May 19, 1989.

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