High thermal resistance, high electric conductivity copper base

Details High thermal resistance, high electric conductivity copper base High thermal resistance, high electric conductivity copper base

1981-06-02

1983-08-23

Skiff, Peter K.

Alloys or metallic compositions

Copper base

Aluminum, gallium, indium, or thallium containing

420494, 420499, 420500, C22C 900

Patent

active

044003510

ABSTRACT:
An improved copper base alloy having excellent thermal resistance and electric conductivity. The alloy consists essentially of from 0.0005 to 0.01 percent boron, a material selected from the group consisting of phosphorus from 0.001 to 0.01 percent, indium from 0.002 to 0.03 percent, tellurium from 0.001 to 0.06 percent and mixtures thereof, and the balance copper and inevitable impurities. The copper base alloy may further contain from 0.002 to 0.05 percent magnesium whereby the magnesium imparts further enhanced thermal resistance to the alloy.

REFERENCES:
patent: 2264287 (1941-12-01), Betterton et al.
patent: 2479311 (1949-08-01), Christensen et al.
patent: 3677745 (1972-07-01), Finlay et al.
patent: 3773503 (1973-11-01), Kranz et al.
CDA, "The Effect of Research and Design on the Use of Copper on the Electrical Industry", Copper Development Assoc., Oct. 1962, 1962, pp. 15 & 22.
Mendenhall, Understanding Copper Alloys, Olin Corp., East Alton, Ill., 1977, p. 304.

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