Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1992-03-13
1993-06-08
Thompson, Gregory D.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
361382, 361386, 361412, 257712, 257714, H05K 720
Patent
active
052185150
ABSTRACT:
Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multichip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.
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Gaither Roger S.
Moser William R.
Sartorio Henry P.
The United States of America as represented by the United States
Thompson Gregory D.
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